29 5 / 2012
Patently Apple has exposed a new patent which reveals that Apple is planning to implement multi-tiered haptic technology in its next generation iPhones, iPads and iPod touch. This technology will call for ‘textured feedback’ by using an electrical stimulus.
In contrast to the traditional feedback system, which uses physical contact to generate feedback, the haptic technology causes tactile interaction through PF sensors and actuators. This technology finds its application in robotics, video games and similar other interactive systems.
According to Patently Apple, the haptic technology will be used for actuations like vibration, changing shape or a combination of actuations to provide the users with a tactile feedback system. This technology will give the new handheld devices a layered texture within the display. The virtual layers would deform the display into a button, arrow or a map, forming a depth to give users an illusion of 3D. The layered display would be pressure-sensitive, that would significantly ease-up sketching and painting apps. The display would be able to differentiate relatively higher and lower contact.
Patently Apple has also revealed that it is coming up with a flexible high speed cable capable of handling bends and twists without damage. This cable would be responsible to high speed data transmission with low insertion loss. The report has sparked speculations that the next iPhone might have a round dock connector.
Now that the iPhone 5 is slated for release in October 2012, it would not get this much-awaited advanced technology.
The patent also reveals that the camera in the new iOS devices would get a technological boost in terms of intelligent exposure control. This would prevent the photographs from becoming too bright or dark, subject to over or underexposure.
Apple plans to introduce Sim Tray feature in iPhone 5, which would possibly shun the users’ expectations of a compelling redesign. The ushering of the Sim-Tray feature might result in the retaining of the present box-type design instead of the tear-drop design. The company is also planning to redesign the battery which would make the next iPhone 1.4 mm thinner than the present iPhone 4S.